Quartz glass and borosilicate glass—particularly in forms such as Quartz glass wafers and BOROFLOAT® 33 wafers—exhibit substantial differences in chemical composition, physical properties, and application scope. The following provides a systematic comparison based on composition, performance characteristics, and use cases.
Quartz Glass
Primarily composed of ultra-high-purity silicon dioxide (SiO₂), with a typical purity of ≥99.9%.
The Quartz glass wafer form is produced from this high-purity material, ensuring minimal metallic contamination for use in semiconductor and optical applications.
Borosilicate Glass
Composed mainly of silicon dioxide (approximately 70%–80%), with 8%–13% boron trioxide (B₂O₃) as the primary modifier.
BOROFLOAT® 33, a premium borosilicate glass brand, incorporates small amounts of alkali metal oxides (Na₂O, K₂O) and aluminum oxide (Al₂O₃) to optimize thermal expansion, mechanical strength, and processability.
BOROFLOAT® 33 wafers are precision-cut for use in microfabrication, optical windows, and specialty engineering applications.
Quartz Glass / Quartz Glass Wafer
Can withstand continuous service above 1000 °C and short-term exposure exceeding 1500 °C.
Extremely low thermal expansion coefficient (≈ 0.5 × 10⁻⁶/K), giving wafers excellent dimensional stability during thermal cycling.
BOROFLOAT® 33 / BOROFLOAT® 33 Wafer
Continuous service temperature typically 200–300 °C, with short-term resistance up to ~450 °C.
Thermal expansion coefficient around 3.3 × 10⁻⁶/K, making it superior to standard soda–lime glass but less thermally stable than quartz glass.
Quartz Glass Wafer
Highly resistant to most acids, alkalis, and solvents (except HF), maintaining surface integrity even in aggressive chemical processing.
BOROFLOAT® 33 Wafer
Good resistance to most acids and some alkalis, though prolonged exposure to strong bases or fluorides can cause surface degradation.
Quartz Glass / Quartz Glass Wafer
Outstanding transmission from deep UV (185 nm) to IR regions, ideal for photolithography, spectroscopy, and laser systems.
BOROFLOAT® 33 / BOROFLOAT® 33 Wafer
Excellent visible light transmittance (~92%), suitable for optical windows and cover plates, but lower UV/IR transmission compared to quartz glass.
Quartz Glass Wafer
Requires ultra-pure feedstock and high melting temperatures (~1700 °C), resulting in higher production cost and complexity.
BOROFLOAT® 33 Wafer
Lower melting temperature (~1500 °C) enables efficient large-scale wafer production at reduced cost.
Quartz Glass / Quartz Glass Wafer
Semiconductor wafer carriers, photomask substrates, UV optics, high-temperature laboratory glassware.
BOROFLOAT® 33 / BOROFLOAT® 33 Wafer
Microfluidic devices, precision optics, chemical-resistant sight glasses, heat-resistant cookware and industrial viewing panels.
Performance-driven selection: When extreme thermal stability, chemical inertness, and broad-spectrum optical transmission are required—especially for semiconductor-grade Quartz glass wafers—quartz glass is unmatched.
Cost–performance balance: For many engineering and optical applications, BOROFLOAT® 33 wafers offer a practical combination of durability, chemical resistance, and affordability.
Conclusion: Quartz glass and Quartz glass wafers dominate in high-end optics and semiconductor fabrication, whereas BOROFLOAT® 33 and BOROFLOAT® 33 wafers are widely adopted in precision engineering, laboratory, and industrial settings for their versatility and cost efficiency.
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